High-Speed Electronics Thermal & Signal-Integrity Simulation
Joint electronic-cooling, power-integrity and signal-integrity simulation of dense, high-speed electronics.
−18 ℃
Key-device cooling
56 Gbps
High-speed link
First-pass
Design goal
Thermal · SI · PI
Co-analysis
Simulation approach
Electronic cooling: ANSYS Icepak runs system- and board-level thermal simulation, optimizing airflow, heat sinks and device layout to control chip and key-device junction temperatures.
Signal integrity: ANSYS HFSS / SIwave analyze insertion loss, crosstalk and eye diagrams of high-speed links to protect serial-link transmission quality.
Power integrity: SIwave evaluates IR-drop and decoupling of PCB / package power networks to suppress power noise.
Value
Eliminates thermal, signal and power risks together before board spin, achieving first-pass design and cutting prototype iterations and cost.
For communications, servers, consumer electronics and semiconductor packaging, it builds a reusable multiphysics workflow that improves high-speed-product performance and reliability.
Let engineering get intelligent —starting with a conversation
Whether it's simulation analysis, BIM consulting or a digital-platform build, our engineering team is ready to help.
STSC
Shanghai T-Solutions Co., Ltd.